Oclaro brings zero-chirp tunable XFP to market

Date:
2012-10-29 17:16:00
   Author:
10Gtek
  
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 Week News Abstract For Fiber Series in 10GTEK

The abstract is mainly about the optical communication related products,including: SFP,QSFP,FTTH,GPON,EPON,SFPPLC,PTN,ODN,Sfp Transceiver,Optic Transceiver,Optical module,Optical devices,optical communications,Optical transceiver module,Etc.
 
 
Oclaro brings zero-chirp tunable XFP to market
The zero chirp tunable XFP comes in multiple configurations, including APD or PIN receiver options. The tunable XFP is fully qualified and released to production, complementing Oclaro’s negative-chirp tunable XFP.According to Jim Haynes, president and general manager of Oclaro's Photonic Components Business Unit, "Our customers need tunable lasers in a variety of formats and our goal is to be the one-stop shop with the solutions that match their evolving product requirements."Speaking with Lightwave, Robert Blum, who runs product marketing for the Photonic Components Business Unit, said that Oclaro has the technology in-house to produce tunable devices in even smaller footprints. He declined to say when the company might have a competitor to the tunable SFP+ JDSU has promised to make available next year 
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Xilinx's RocketPHY XFP design kit enables deployment of standards-based XFP optical transceiver modules
At the Embedded Systems Conference, Xilinx announced the immediate availability of its RocketPHY XFP design kit featuring the company's RocketPHY 10-Gbit/sec physical layer transceivers. The kit includes a host board designed to accommodate a 10 Gigabit small form-factor pluggable (XFP) optical transceiver, and enables an easy migration path from the 300-pin multisource agreement (MSA) compliant optical transponder modules to the emerging XFP optical transceiver module specification. The XFP board is designed for applications requiring high-speed serial interfaces in the MAN, WAN, LAN and SAN.The RocketPHY XFP design kit allows telecommunications, data communications, and storage system OEMs to easily deploy low cost XFP modules into their existing systems without consuming internal design resources. The RocketPHY XFP design kit can also be used to evaluate third party XFP module vendors, or for interoperability testing between different XFP modules and the RocketPHY 10-Gbit/sec physical layer transceiver. Xilinx has validated interoperability with the leading XFP modules currently available.The RocketPHY XFP board may be operated in a standalone configuration for demonstration and evaluation purposes, or connected via the industry standard 300-pin MSA connector to a user's system (line card) in place of a traditional 300-pin MSA optical module for in-system evaluation. The board will fit into most MSA footprints, including the small-form-factor (SFF) 300-pin MSAs. A Xilinx CoolRunner-II CPLD is also on board to allow reconfiguration of all control pins routed to and from the 300-pin MSA connector. In addition to the RocketPHY on-chip loopback mode, a separate loopback board is provided with the kit to enable external parallel side RX to TX loopback. The loop backboard can also be used to set fixed 16-bit words on the parallel TX input to enable fixed pattern testing and system debug.
Price and availabilityThe RocketPHY XFP kits are currently available with or without an XFP module. Each kit includes the RocketPHY XFP board with the XFP 30-pin connector, cage, heat sink, external loopback board, and CD-ROM with all applicable documentation, including data sheets, user guides, BOMs, schematics, and Gerber files of the board design. Option one of the XFP kit (PN#: HWK-RPHY2XFP), without the XFP module, is priced at $1,995 in small quantities. Option two of the XFP kit (PN#: HWKDO-RPHY2XFP-M) includes a third-party XFP optical transceiver module and is priced at $3,495. Xilinx also offers an available RocketPHY Evaluation kit. This kit includes an Eval board with SMA connectors for detailed device performance evaluation. Qualified customers can order these and other kits by contacting a Xilinx sales office.
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The rise and rise of XFP
XFPs like this 40-km transceiver are rapidly being designed into both telecom and datacom applications.
Standardized 10-Gbit/sec XFP optical transceivers are now moving to the metro line side to offer carriers critical opex savings. Will XFP dominate the 10-Gbit/sec metro space -- and elsewhere?Steffen Koehler Bookham Technology XFP,
the latest of the standardized form factors for 10-Gbit/sec optical transmission modules, has come a long way quickly. Many carriers have deployed XFP devices in the field to successfully carry growing amounts of live traffic. These initial deployments are primarily for client-side short-reach applications, but second-generation XFP devices are now appearing that will go on the metro line side to handle longer reaches and DWDM. The deployment of these long-reach XFP devices is likely to occur very rapidly.Evolution of 10-Gbit/sec form factors Multi-source agreement (MSA) form factors for 10-Gbit/sec optical transponders and transceivers have evolved along two separate paths that are now converging on XFP as a universal long-term solution. On the telecom side, the long-established 300-pin transponder module was adapted for SONET OC-192 and SDH STM-64 protocols. On the datacom side, three additional hot-pluggable form factors were introduced: XENPAK, XPAK, and X2 for 10 Gigabit Ethernet (see Table). But both the telecom and datacom markets are now starting to migrate to XFP, bringing about a reconvergence that embraces core switching/routing applications -- with enterprise applications soon to follow.The XFP module is an ultra-small, hot-pluggable, 10-Gbit/sec optical transceiver form factor that was standardized by the XFP MSA Group to help drive cost and power consumption out of 10-Gbit/sec optical networking applications, while enabling rapid advances in port density.XFP specifies transceiver operation, so the electrical and optical data are both serial. 300-pin, XENPAK, XPAK, and X2, in contrast, are transponders and have an integral SERDES to map several lower-rate parallel electrical streams into a higher-rate serial optical stream, and vice versa. So XFP separates the cost of the SERDES chip from the optical module, allowing independent optimization and lower-cost optical sparing. Even better, SERDES chips that drive multiple XFPs are now emerging, further reducing the cost per XFP port.
In general, XFP costs approximately 30% to 40% less than other MSA form factors, and is far more compact, giving two to three times the density. As it is multiprotocol and hot-pluggable, it's not surprising that the industry is lining up behind it. But there is still controversy over the very practical questions of how fast each application will move to XFP -- and therefore how quickly it will displace the other MSA form factors.XFP adoption drivers XFP applications have taken 
a few twists as the transceivers have moved from concept to deployment. Many people thought that the storage market would be a key early adopter; instead, most Fibre Channel-based SANs are not moving directly to 10-Gbit/sec, but are making a detour via the intermediate speed of 4 Gbits/sec, and then perhaps to 8 Gbits/sec. It turns out that early adoptions of XFP have been in SONET/SDH, core switching and routing, and nontraditional Gigabit Ethernet applications, such as DSL extension.It is also interesting to note the changing value proposition as the XFP moves from the client to the line side. Capital expenditure (capex) savings from higher port densities and lower prices are very important here, as they are on the client side, so XFP will have a big impact on metro networking in terms of lower costs. But as carriers continue to look for ways to cut costs beyond today's capex rates, operating expense (opex) savings have suddenly sprung to prominence.And even here there is a twist. Hot pluggability clearly leads to lower opex by simplifying network reconfiguration and maintenance, but this is not the most important factor. The key point is that in today's competitive and volatile environment, carriers' link capacity forecasts are often inaccurate. With XFP, discovering three days before a network is due to be turned up that a 40-km link needs to be replaced by an 80-km link on a different wavelength is not a problem -- it's the same slot, just plug in a different wavelength or reach. This reduced sensitivity to forecasting errors is a fundamental advantage for line-side XFP applications.Market impacts 300-pin devices dominate the current
 installed 10-Gbit/sec module base, but will now begin to face replacement by XFP. Although XENPAK deployments are also growing, XENPAK is not multiprotocol, being specific to 10-Gigabit Ethernet -- and, as Table 1 shows, it is very bulky and power-hungry compared to XFP. XPAK and X2 aim to fix some of XENPAK's limitations and allow support of the OIF's new SFI-4 Phase 2 interface in place of the XAUI interface, but they are still larger and more complex than XFP. Most industry observers expect XENPAK,XPAK, and X2 to play a transitional role until XFP becomes dominant.In telecom, virtually all new client-side designs are now using XFP. So XFP is effectively displacing 300-pin modules at the rate at which existing 300-pin designs become obsolete -- in fact, a little faster because there are also cost-reduction redesigns going on.On the metro line side, Bookham believes that in 2005, XFP will become widely deployed for 40- and 80-km reaches and XFP-based WDM deployments will begin. In 2006 we will see >80-km replacements as we start to put longer-reach technologies in XFP. These advances include a combination of technologies such as III-V modulators and electronic dispersion compensation (EDC); they mark an increased erosion of the 300-pin module metro market. One area that will hold on to that 300-pin form factor for a longer period will be long-haul devices.XFP will also be able to exploit large new opportunities in enterprise networks, especially the forthcoming IEEE 10-Gigabit Ethernet standard 10GBase-LRM that operates on FDDI-grade multimode fiber for links of several hundred meters. This is an ideal capacity upgrade for existing 1-Gigabit Ethernet (1000Base-SR) links between a wiring closet and a data center, because the existing fiber plant can be reused. This is expected to be a very large application, involving large module volumes.In summary, XFP is expanding in both directions from its initial deployments as 2- to 10-km client-side links, with metro applications demanding longer reaches and DWDM on the high side, and enterprise applications optimized for short, multimode fiber spans on the low side. Its versatility, low cost, and small footprint are making XFP the form factor of choice for an ever-growing set of 10-Gbit/sec communications applications.
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The above information is edited by 10GTEK.
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