Pacnet and Infinera Corp
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NebraskaLink selects Telco Systems to build Ethernet network in Nebraska
Stimulus money will help extend metro Ethernet services across the state of Nebraska. Telco Systems, a BATM company (LSE: BVC), says it has been chosen by NebraskaLink, a consortium of seven Nebraska telephone companies, to provide an end-to-end Carrier Ethernet service for its county-wide fiber-optic network.The NebraskaLink network serves community anchor institutions including over 100 schools, colleges, and universities across the state. The upgrade will extend services to community institutions, businesses, mobile operators, and other service providers across the state. In addition, the new fiber-optic network will serve hospitals, medical clinics, public safety services, city, county governments, and key businesses and industries in Nebraska. The aim is to provide high-end broadband Ethernet-based services to meet increasing broadband access needs and provide competitive carrier options to its customers.The project has been made possible by a grant of $11.5 million from the National Telecommunication and Information Administration (NTIA) together with $5 million from NebraskaLink members.The carrier uses Telco Systems T-Marc demarcation line and T-Metro aggregation switches to offer up to 1 Gbps to mobile backhaul operators, businesses, and educational institutions, combined with a multi 10 Gigabit Ethernet (10GbE) network to deliver assured, reliable, high-availability Ethernet services and backbone connectivity throughout the state.“Our MEF Carrier Ethernet 2.0 compliant Metro Ethernet portfolio enables NebraskaLink to offer a service-centric network with new levels of capacity, scalability and reliability while ensuring cost-efficiency and competitiveness with other providers in the state,” said Reini Florin, vice president of sales, USA and Canada, for Telco Systems. “Using our solution, NebraskaLink can offer new broadband business and wholesale services to address their customers’ growing needs for cost-effective, fiber-based, high-speed connectivity across the entire State of Nebraska”.
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Pacnet and Infinera demo 500G optical superchannels in Asia
Pacnet and Infinera Corp. (NASDAQ: INFN) have completed a joint demonstration in which they transmitted more than 3 Tbps of optical capacity over 4,500 km of Pacnet’s C2C undersea network using Infinera’s photonic integrated circuits (PICs) and FlexCoherent superchannels.Infinera is one of the first vendors to implement superchannels, and claims to be the first to demonstrate superchannels based on 500-Gbps photonic integrated circuits (PICs). A superchannel is a large unit of optical capacity created by combining multiple optical carriers into a single managed entity, so that optical networks can scale capacity without scaling operational cost and complexity (see "Superchannels to the rescue"). Superchannels based on PICs enable operators to simply provision 500 Gbps of capacity with a single operational maneuver.The demonstration highlights the application of Infinera’s 500G superchannel technology to ultra-long-haul subsea communications. It also demonstrated the ability to use FlexCoherent technology to software select the modulation format to optimize fiber capacity and reach.The test was conducted with Infinera’s DTN-X platform, which has begun shipping this quarter (see “Infinera debuts DTN-X packet-optical transport platform with 500G PIC, OTN/MPLS support”).Pacnet owns and operates a major pan-Asian submarine cable network extending from India to the US and touching 21 cable landing stations. At the heart of this network is EAC-C2C, which spans 36,800 km.“We are impressed with Infinera’s DTN-X platform delivering 500-Gbps FlexCoherent superchannels and integrated OTN switching without compromise,” said Bill Barney, Pacnet’s CEO. “This successful test with Infinera demonstrates that Pacnet’s network can scale up with the industry’s latest high-speed optical technologies to deliver faster services to our customers.”
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OneChip unveils PIC-based 40G and 100G receiver chips
OneChip Photonics Inc. says engineering samples of its photonic integrated circuit (PIC)-based 40GBase-LR4 and 100GBase-LR4 receiver chips will be available for partner testing in the second half of this year.The new chips will enable transceiver manufacturers to address short and intermediate reach (up to 10 km), long-wavelength (around 1300 nm) data communications applications more cost-effectively and efficiently than ever before, the startup claims.The PIC-based receiver chips monolithically integrate, on a single indium phosphide (InP)-based chip, all of the active and passive optical components required to receive 40GBase-LR4 or 100GBase-LR4 signals. The chips will be ideally suited to data communications applications in general, and the development of high-density interfaces for next-generation data center interconnects in particular, OneChip asserts.Karen Liu, principal analyst for components at market research firm Ovum, said, "The industry is in the midst of switching gears from raw device speed to photonic integration, as optical interconnect speeds reach 40 Gbps, 100 Gbps, and beyond. PIC chips like OneChip's offering will be critical to enable the required cost and density for transceiver and system solutions addressing exploding communications needs in a wide variety of applications."OneChip also expects to make engineering samples of its 40GBase-LR4 transmitter optical components and 100GBase-LR4 single-chip transmitter PICs available later in the year, after the release of its PIC-based receiver chips. The 40GBase-LR4 transmitter components will include spot-size converted DFB directly modulated lasers at 1271, 1291, 1311, and 1331-nm wavelengths, with integrated monitor photodiodes. The 100GBase-LR4 transmitter PICs will integrate four DFB-EAM externally modulated lasers operating in the 1300-nm window on 800-GHz spacing at 25 Gbps each, monitor diodes, a WDM combiner, and spot-size converter on a single chip.OneChip claims that its PIC-based 40GBase-LR4 and 100GBase-LR4 integrated receiver chips will cost significantly less to package and manufacture than competing hybrid integration and silicon photonics technologies, and will also have the smallest footprint on the market. The company anticipates these PICs will make LR4 transceivers cost-effective enough to be used at short- and intermediate-range applications in the data center.OneChip’s PICs are designed and manufactured using its “multi-guide vertical integration” (MGVI) platform – the company's unique, regrowth-free photonic integration technology -- resulting in lower costs and higher yields than alternative approaches, the company claims.
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The above information is edited by 10GTEK.
10GTEK TRANSCEIVERS CO., LTD (Hereinafter refered to as 10GTEK) is specialized in developing and manufacturing Fiber Optical Transceivers and High Performance Cables which are wildly applied in Datacom, Telecom and CATV, providing customers with top quality and cost effective products. Our High Speed Cables cover Passive SFP+ Cable, Active SFP+ Cable, QSFP+ cables, MiniSAS (SFF-8088) Cables, CX4 Cables, Harness cables, Breakout Cables, Patchcords. We also manufacture Fiber Optic Transceivers like 10G XFP, 10G SFP+, SFP DWDM/ CWDM, GBIC, etc. The prompt response and excellent customer support contribute to clients‘ full satisfaction.Today, 10GTEK has been growing fast in the optical field for its unique and competitve excellence which has got a high attention from datacom and telecom.
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